Eight papers from the Society's February 1998 conference in Detroit discuss issues of packaging electronics in automobiles. The topics include advanced substrate materials, interconnect materials, reliability prediction, and thermal-mechanical modeling. Among the state-of-the-art technologies described are the ball grid array, integrated simulation-testing, lead-free solder, and physics-based reliability methods. No index. Annotation c. by Book News, Inc., Portland, Or.
Electronic Packaging (S P (Society of Automotive Engineers)) pdf download
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